340 Wedge-Tainer

nVent Schroff, Hybrid design (channel and Card Lok combined) for PCB retention and thermal transfer in cold wall or sheet metal applications. Ideal for applications where a Card Lok cannot be mounted to the PCB, or where a machined cold wall slot is not available or not desired to reduce costs Available with gold chem film, clear chem film, black anodized, hard black anodized, or electroless nickel plating Weight 2.65 g/cm Flexible mounting options 3 or 5 segment, wedge tainer design Screw actuated Length 76.2 mm to 317.5 mm, 12.7 mm increments Insertion depth 5.84 mm, V model for VME/cPCI 2.29 mm For sheet metal applications